1.微型机械手A micro-manipulator;
2.分子动力学 Molecular dynamics;
3.碳峰窝 honeycomb carbon;
4.电容半圆 capacitive semicircles;
5.对磨球 counterbodies;
6.磁弹磨粒Magneto-elastic abrasive particles;
7.刀具刃口处理Tool edge treatment;
8.单分子层Monolayers;
9.飞秒激光 Femtosecond laser;
10. 推进接触角 Advancing contact angle;
11.自清洁Self-cleaning;
12.石墨化Graphitization;
13.计算流体力学 Computational fluid mechanics;
14.弹性模量Elasticity modulus;
15.压力声学Pressure acoustics;
16.多孔弹性波Porous elastic wave;
17.多智能体multi-agent;
18.随机有限集random finite set;
19.模型预测控制model predictive control;
20.信号处理signal processing;
21.刀具磨损 Tool wear;
22.双磁盘磁场Dual disk magnetic field;
23.外延生长epitaxial growth;
24.原位热处理In-situ H;
25.高斯光束gaussian beams;
26.折射率refractive index;
27.波粒二象性partical-wave dualism;
28.塑性形变Plastic deformation;
29.晶格应变Lattice strains;
30.再结晶温度Recrystallization temperature;
31.固溶强化Solid-solution strengthening;
32.吉布斯相律Gibbs phase rule;
33.质子交换膜燃料电池PEMFC:Proton Exchange Membrane Fuel Cells;
34.双极板bipolar plate;
35.膜电极MEA;
36.阳极anode;
37.阴极cathode;
38.单搭盲铆接头Single-lap blind riveted joints;
39.局部感应退火Local induction annealing;
40.摩擦自冲孔铆接Friction self-piercing riveting;
41.动态再结晶Dynamic recrystallization;
42.数字孪生Digital Twin;
43.数字工程Digital engineering;
44.虚实交互Virtual-real interaction;
45.激光辅助加工Laser-assisted machining;
稿件文字来源:贵州大学机械工程学院2023级博士
编辑:编辑部余弦